Icepak solver improvements enable 10 to 100X faster times for MCAD geometry processing and solving. Ansys Icepak’s Joule heating analysis solves coupled electrothermal problems with static or transient excitations, while thermal ROM simplifies setup for variable flow rate problems.With EMA3D Cable’s mesh subgrid, engineers can define regions in the model where the mesh cell size can be different from the rest of the model.Ansys SI Xplorer helps PCB designers to define stack-up and optimize via transitions.Ansys HFSS SBR+ enables efficient simulation of 3D dielectrics such as automotive bumper fascia and antenna radomes.
#Ansys designmodeler plus
Ansys HFSS Phi Plus meshing dramatically increases speed and capacity for 3D IC packaging simulation, including wire bonds.Ansys introduces the Electronics Desktop Student version.The new APIs to control the sensor simulation and access raw sensor output will increase productivity through the support of your specific process and engineering tools.Īnsys 2021 R2 delivers groundbreaking technologies to address challenges in 3D IC, autonomy, 5G and electrification. You will benefit from new NCAP Autonomous Emergency Braking (AEB) and Lane Support Systems (LSS) scenarios compliant with physics-based simulation in day and night driving conditions. Radar experts are now able to model multi-modes and see micro-Doppler effects. With this latest release, headlamp designers gain new certification tests along with added capabilities for analysis, while our sensor modeling users benefit from significant productivity gains when parameterizing their models and their vehicle configurations. You can quickly and easily verify and validate AV sensor configurations, including perception and autonomous driving features, with the driving simulation tool of your choice.
This release includes new capabilities for sensor simulation and asset preparation, as well as an enriched library of assets.
In addition, every analyst can now benefit from Ansys Discovery’s geometry modeling workflows, groundbreaking Discovery Live physics and innovative user interface. With access to nearly limitless computing via Ansys Cloud, engineers who use Ansys 2021 R2 products have the speed and flexibility to ask the “what-if” questions that lead to innovations in autonomous vehicles, chip design, mission-critical connectivity solutions and more sustainable travel via lightweight materials and electrification.Īnsys 2021 R2 continues to expand simulation capabilities and ease of use for every engineer to unlock innovation and increase productivity throughout the product development process. New design ideas can be virtually evaluated in hours, not weeks, freeing up time to optimize the best design candidates or develop moonshot ideas that redefine markets.
#Ansys designmodeler free
Ansys' industry-leading simulation solutions provide an open approach that streamlines engineering via simplified workflows, integrated data management and easy access to high-performance computing (HPC) power via the cloud.Įngineering exploration via simulation is virtually risk free because engineers are no longer bound to an expensive and time-consuming prototype-test-redesign cycle. Improvements in Ansys 2021 R2 products provide the power to explore early stage product design and complex system engineering from the nanometer scale of chip design to the mission level of aerospace and defense operating environments.